| 摘要 |
PROBLEM TO BE SOLVED: To realize a method for mounting a semiconductor chip by which sealing resin can be filled in a short time without leaving any bubble in the clearance between a circuit board and a semiconductor chip by improving the method for filling the sealing resin in the clearance therebetween. SOLUTION: When the clearance G1A between a circuit board 20A and a semiconductor chip 10A is filled with sealing resin 40A, the resin 40A is applied to an area corresponding to a long side 101A. In addition, the area to be coated with the resin 40A is limited inside both ends of the side 101A (shown by an arrow mark A1). Then, the board 20A is directly heated from its rear side by a heat block BL, and the chip 10A is heated in non-contact by a light beam L (light energy) emitted to the rear side. As a result, the resin 40A is heated through both boards 20A and chip 10A and flows into the inside of the clearance G1A and it is cured thereafter. |
