发明名称 |
BONDED PIN EXTRUSION DIE AND METHOD |
摘要 |
A honeycomb extrusion die and a method of making the die are disclosed, the die being made by bonding a die discharge section formed as a separate pin array to a separate die body incorporating an array of feed channels, the pin array comprising a plurality of pins attached to and extending outwardly from a body-compatible pin support which is removed after bonding the pins to the body. The pins may be formed of hard wear materials, and may have any of a variety of cross-sectional shapes adapted to improve extrusion uniformity as well as to form honeycomb cells of a variety of different cross-sectional shapes. |
申请公布号 |
CA2188640(A1) |
申请公布日期 |
1997.05.31 |
申请号 |
CA19962188640 |
申请日期 |
1996.10.23 |
申请人 |
CORNING INCORPORATED |
发明人 |
KRAGLE, HARRY ARTHUR;STUMPFF, FLOYD E. |
分类号 |
B29C47/12;B28B3/20;B28B3/26;(IPC1-7):B23P15/00 |
主分类号 |
B29C47/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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