发明名称 |
Cooling structure for integrated circuit element modules, electronic device and heat sink block |
摘要 |
In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the main duct and supplies a coolant to the main duct.
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申请公布号 |
US5640046(A) |
申请公布日期 |
1997.06.17 |
申请号 |
US19950431978 |
申请日期 |
1995.05.01 |
申请人 |
FUJITSU LIMITED |
发明人 |
SUZUKI, MASAHIRO;FUJISAKI, AKIHIKO;ISHIMINE, JUNICHI |
分类号 |
H05K7/20;H01L23/433;H01L23/467;(IPC1-7):H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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