| 摘要 |
A new grinding medium consisting essentially of a synthetic resin matrix in which small-sized foam, coarse powdery abrasives and fine powdery abrasives are dispersed is provided. A powder having a low electric resistance is added to the medium to form relatively large-sized foam around the powder. The medium is preferably produced by softening and blocking a synthetic resin powder by high-frequency dielectric heating to form a matrix of the synthetic resin and dispersing small-sized foam, coarse powdery abrasives, fine powdery abrasives and powder having a low electic resistance in the synthetic resin matrix wherein relatively large-sized foam is formed around the powder. The medium has a high ability of abrasion and the surface of the medium is smoothly renewed during the grinding process so that the medium has an excellent grinding effectiveness.
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