| 摘要 |
PROBLEM TO BE SOLVED: To meet the requirements of design specification changes of a semiconductor device by a method wherein terminal electrodes are arranged on a wiring board so as to change functions in accordance with the connection states of SMT-type electrical continuity units which connect the identical function control terminals of a plurality of memories to outer terminals respectively. SOLUTION: One jumper chip 4 is mounted between a land 12c and a land 12d on a wiring board 2a with solder so as to correspond to a memory module with an access time of 85ns. Two jumper chips 4 are mounted to bring lands 12a and 12b and lands 12c and 12d in a continuity with each other so as to correspond to a memory module with an access time of 100ns. No jumper chip 4 is mounted to correspond to a module with an access time of 120ns. With this constitution, the manufacturing lead time of a memory module can be shortened significantly and, further, the design cost, the manufacturing cost, etc., can be reduced and an economical memory module can be obtained.
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