| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is able to improve connection reliability on the second semiconductor chip side while enduring heat dissipation on the first semiconductor chip side.SOLUTION: A semiconductor comprises: a heat sink 15, and a first semiconductor chip 13 and a second semiconductor chip 14 that are disposed on one side 15a of the heat sink, the first semiconductor chip being greater in calorific power than the second semiconductor chip. The counter face of the first semiconductor chip to the heat sink has a collector electrode 13a. The collector electrode is connected to the heat sink via solder 24. The second semiconductor chip is formed from a material greater in Young modulus than the first semiconductor chip, and has a drain electrode 14a on its counter face to the heat sink. The drain electrode is connected to the heat sink via solder 25. Of the solder 25, the thickness of the drain electrode, corresponding to one part of the outer peripheral end of the drain electrode is greater than the maximum thickness of the solder 24.SELECTED DRAWING: Figure 5 |
