发明名称 WIRING BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To make the electric connection between single element metal powders secure by attaching wiring conductors consisting of a thermosetting resin and metal members united/formed by alloying a plurality of single element metal powders, to an insulating base substance formed by uniting an inorganic insulator powder with a thermosetting resin excellent in toughness. SOLUTION: Three insulating base substance sheets 1a, 1b, 1c for constituting an insulating base substance 1 are formed by uniting 60-95wt.% of an inorganic insulator powder with 5-40wt.% of a thermosetting resin. And wiring conductors 2 composed of a thermosetting resin and metal members united/formed by alloying at least two kinds of single element metal powders are attached to the insulating base substance 1 from the periphery of a recession 1d to the underside surface. Consequently, it becomes possible to prevent the insulating base substance from chipping off, splitting, cracking, etc., to make the electric connection between the single element metal powders secure, and to lower the electric resistances of the wiring conductors 2, even if wiring boards collide with each other fiercely or a wiring board collides with a part of a semiconductor device manufacturing automatic line fiercely.
申请公布号 JPH09232472(A) 申请公布日期 1997.09.05
申请号 JP19960038464 申请日期 1996.02.26
申请人 KYOCERA CORP 发明人 KATORI NAOHIRO
分类号 H05K1/09;H01L23/12;H01L23/14;H05K1/03;H05K3/00;H05K3/12;(IPC1-7):H01L23/14 主分类号 H05K1/09
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