发明名称 Method for forming ferroelectric thin film and apparatus therefor
摘要 A ferroelectric thin film superior in coatability, fineness of structure and uniformity of composition, is obtained by a method comprised of inducing ferroelectric reactant materials consisting of plural elements into dissociation by exciting plasma with RF power in order for them to participate in a deposition reaction; setting an optimal process condition in which the ions dissociated from the reactant materials by the excited plasma are subjected to deposition at high temperatures under low pressures; supplying the reactant materials through conduits, a manifold and a shower head to a reactor without deterioration, the manifold collecting the reactant materials, the shower head serving to spray the mixed reactant materials; and depositing a ferroelectric thin film in the reactor while purging residual gas from the conduits.
申请公布号 US5670218(A) 申请公布日期 1997.09.23
申请号 US19960729676 申请日期 1996.10.03
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 BAEK, YONG KU
分类号 C23C14/44;C23C16/40;C23C16/44;C23C16/455;C23C16/50;C23C16/509;H01L21/31;H01L21/316;H01L21/8242;H01L27/108;(IPC1-7):H05H1/25 主分类号 C23C14/44
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