发明名称 Multichip card e.g. telephone card
摘要 The multi-chip card has a card body, preferably made of plastic. This has recesses which contain chips (CH). The chips have metallic contacts on an upper surface. One or more contact surfaces (KFL), are provided on the card body. These surfaces (KFL) have several contact elements to provide an electrical contact with the receiving device. The contact elements are electrically connected to the contacts of the chips (CH). The contact elements of the contact surface (KFL) are preferably connected to the contact elements of the chips (CH) via a contact film (KFO) with one or more electrical conductors. The contact film (KFO) is preferably constructed as a one- or multi-layer circuit board and may have through contacts. One contact surface (KFL) may be connected to several chips (CH). The chips (CH) may be connected in parallel and only that chip which is responsive to the particular application may react to the read current of the receiving device. The particular chip suitable for the particular application may be selected by the user. A control device may be provided on the card which connects the specific chip for the particular application to the contact surface (KFL). The control device may be contained in a special control chip. An optical display e.g. a light diode, may be provided to indicate the selected chip. The contact film (KFO) may be in the form of a flexible circuit board and the contact elements of the contact surface may be parts of the contact film which are metallically reinforced.
申请公布号 DE19611237(A1) 申请公布日期 1997.09.25
申请号 DE19961011237 申请日期 1996.03.21
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 STELZER, MANFRED, DIPL.-ING. (FH), 81369 MUENCHEN, DE
分类号 G06K19/077;(IPC1-7):G06K19/077;H05K1/18 主分类号 G06K19/077
代理机构 代理人
主权项
地址