发明名称 |
Method of forming an electrically conductive polymer bump over an aluminum electrode |
摘要 |
A method of forming an electrically conductive polymer bump (22) over an aluminum electrode (21) produces low contact resistance for an interconnect structure (24). Aluminum oxide is first removed from the aluminum electrode (21). Tiron and palladium are subsequently bonded to the fresh surface of the aluminum electrode (21). Finally, the electrically conductive polymer bump (22) is formed over the aluminum electrode (21). The Tiron and palladium improve the electrical contact between the conductive polymer bump (22) and the aluminum electrode (21) thereby reducing the contact resistance. The Tiron also inhibits corrosion of the aluminum electrode (21) and enhances the conductivity by catalytically shrinking the cyanate ester conductive bump.
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申请公布号 |
US5674780(A) |
申请公布日期 |
1997.10.07 |
申请号 |
US19950505936 |
申请日期 |
1995.07.24 |
申请人 |
MOTOROLA, INC. |
发明人 |
LYTLE, WILLIAM H.;FANG, TRELIANT;LIN, JONG-KAI;SHARMA, RAVINDER K.;SAHA, NARESH C. |
分类号 |
H01L21/60;(IPC1-7):H01L21/283 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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