| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus which can minimize pollution on a wafer during transportation of a substrate to be processed such as a wafer within a closed type substrate to be processed (wafer cassette). SOLUTION: A wafer cassette 3 is divided by a wall part 12 into a mounting region (first atmosphere) and a wafer transportation region (second atmosphere), the wall part 2 is formed therein with an opening 21, the wafer cassette 3 is loaded from the first atmosphere side, and the wafer is extracted from the wafer cassette in the second atmosphere side. A gap between the opening 21 and wafer cassette is sealed with an O-ring 22, a sealing member 54 is disposed between a peripheral edge of the opening 21 at the second atmosphere side and a wall cover 51 to seal the atmosphere within the opening 21 from the first and second atmospheres, and an N2 gas is supplied into the opening 21 while air within the opening is drawn. |
