发明名称 APPARATUS AND METHOD FOR SURFACE TREATMENT
摘要 PROBLEM TO BE SOLVED: To eliminate the need for reducing the pressure from the atmospheric pressure, each time a work is fed into a main treating chamber to reduce the tact time by providing a gate to shut or connect the main treating chamber from or to an aux. treating chamber and carrier which holds and places the work in the aux. chamber to close an opening. SOLUTION: A gate cylinder 19 is actuated to shut off a main treating chamber 16 from an aux. treating chamber 17 and close it, and a vacuum pump 23 is actuated to provide a low pressure atmosphere in the main chamber 16. A work W is fed and a turn table 1 is rotated to move the work W to a treating station S1 and placed in the aux. chamber 17 to close it with a carrier 5. The cylinder 19 is actuated to place the gate at the dished line position, the main chamber 16 is coupled to the aux. one 17, and immediately the surface treatment is made by an ion gun 21. As the chamber 16 is once set to a low pressure atmosphere, the surface treatment can be started immediately after the gate 18 is opened. This reduces the time loss.
申请公布号 JPH09321116(A) 申请公布日期 1997.12.12
申请号 JP19960131529 申请日期 1996.05.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORISAKO ISAMU;YAHIRO KANJI
分类号 C23F4/00;H01L21/302;H01L21/3065;H01L21/677;H01L21/68;(IPC1-7):H01L21/68;H01L21/306 主分类号 C23F4/00
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