发明名称 Vacuum coating device for application of substrate thin-film layers
摘要 The vacuum coating device has at least one additional particle beam focusing device coupled to an additional voltage source, e.g. a MF voltage source (45) and provided with at least one grid (40). Pref. the MF voltage provided by the additional voltage source is overlaid with a DC voltage and applied to the grid. The vacuum coating device pref. uses a magnetron sputtering device for vapour deposition of thin-film layers.
申请公布号 DE19641584(C1) 申请公布日期 1998.01.08
申请号 DE19961041584 申请日期 1996.09.30
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 KRUEGER, URSUS, DR., 13595 BERLIN, DE;SCHIEWE, HEIKE, DIPL.-ING., 12167 BERLIN, DE;SCHILLING, WOLFGANG, DIPL.-PHYS., 91074 HERZOGENAURACH, DE
分类号 C23C14/22;C23C14/32;C23C14/35;H01J37/34;(IPC1-7):C23C14/35;H01J37/317 主分类号 C23C14/22
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