发明名称 PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a processing device wherein a substrate introduction cycle can be sufficiently shortened in substrate processing. SOLUTION: A plurality of vacuum processing chambers 4 and 8 are, through a gate 22, connected to a vacuum transportation chamber 10. In the vacuum transportation chamber 10, a plurality of load lock chambers are provided radially through the gate 22, they constituting a load lock chamber unit 20. On the outside of the unit 20, a cassette 40 for holding a substrate is provided. In addition in the vacuum transportation chamber 10, a substrate transportation mechanism 60 which transports the substrate between each load lock chamber and each vacuum processing chamber is provided, further, a substrate transportation mechanism 50 which transports the substrate between the cassette 40 and each load lock chamber is provided. A plurality of vacuum processing chambers are provided above a plurality of load lock chambers, and the substrate transportation mechanism 50 sequentially performs carrying in/out of the substrate to each load lock chamber while the load lock unit 20 is rotated.
申请公布号 JPH1012695(A) 申请公布日期 1998.01.16
申请号 JP19960164496 申请日期 1996.06.25
申请人 TOKYO ELECTRON LTD 发明人 HIROKI TSUTOMU
分类号 B25J9/06;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B25J9/06
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