| 摘要 |
PROBLEM TO BE SOLVED: To contrive not to cause short circuits between adjacent solder layers respectively provided on the upper surfaces of wiring conductors due to the surface tension of solder, weights of electronic parts, etc., by forming separating zones composed of electrical insulators having thicknesses which are nearly equal to the sum total of the thicknesses of each wiring conductor and solder layer between each wiring conductor on the upper surface of an insulating substrate. SOLUTION: Separating zones 4 composed of electrical insulators having thicknesses which are nearly equal to the sum total of the thicknesses of each wiring conductor 2 and each solder layer 3 provided on the upper surface of the conductor 2 are provided between each wiring conductor 2 on the upper surface of an insulating substrate 1. Therefore, the occurrence of short circuits between adjacent solder layers 3 due to the surface tension of solder, weights of electronic parts 7, etc., can be prevented, because walls are formed of the zones 4 between adjacent solder layers and, even when the solder layers 3 are melted by heating at the time of mounting electronic parts 7 on a wiring board A, the width and height of molten solder are controlled by the zones 4. Consequently, the wiring conductors on the wiring board can be connected surely and excellently to the terminal electrodes of the electronic parts. |
