PRODUCTION OF POLYIMIDE RESIN BONDING FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a polyimide resin bonding film without deteriorating the tensile breaking strength thereof. SOLUTION: One or both surfaces of a film made of a polyimide resin without thermally melting at <=400 deg.C temperature are coated with a polyimide resin adhesive varnish meltable at <=400 deg.C temperature after solidification and dried to provide a polyimide resin bonding film, which is then stretched under >=0.75 and <=1.75kg/mm tension. The molecular chain orientation of the film, made of the polyimide resin and disordered by heating at the high temperature can be restored by the stretching to prevent the tensile breaking strength of the film from deteriorating.