发明名称 |
EDGE-MOUNTED SURFACE-MOUNT PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE IN TERGRATELES |
摘要 |
<p>A flat package (10) for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic (12) containing a semiconductor chip (11), and flat leads (14) extend from one edge of the package. The leads are bent to provide an area (18) to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs (15) extending from the edge of the package adjacent the leads. The studs have stops (17) formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.</p> |
申请公布号 |
KR0127873(B1) |
申请公布日期 |
1998.04.04 |
申请号 |
KR19890003075 |
申请日期 |
1989.03.13 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BAUDOUIN, DANIEL A.;RUSSEL, ERNEST J. |
分类号 |
H05K1/18;H01L23/495;H01L23/50;H05K3/30;(IPC1-7):H01L23/50;H05K7/12 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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