发明名称 METHOD OF MANUFACTURING CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To maintain precision in positional relation ship with a surface wiring conductor, even when a green sheet deforms in the state of a green sheet prior to lamination process, forming a conductive film which is to be the surface wiring conductor and a film which is to be an over-coat glass layer. SOLUTION: An internal wiring conductor 3 is assigned among layers of dielectric layers 1a-1e of glass-ceramics material. In addition, a laminate 1 constituted which has viahole conductors 4 formed in the dielectric layers 1a-1e. On the surface of the laminate 1, a conductive film of Ag group or Au group which is to be a surface wiring conductor 2 is formed in the state of a green sheet prior to processing of laminate 1, to be contacted to the conductive film and the viahole conductor 4 exposed from the dielectric layer 1a. Further, over the entire surface of the laminate 1, an over-coat glass layer 5 is so formed that a terminal electrode or a connection pad of the surface wiring conductor 3 are exposed. Thereby, even when the green sheet deforms, the over-coat glass layer 5 is kept with precision.
申请公布号 JPH10107442(A) 申请公布日期 1998.04.24
申请号 JP19960258122 申请日期 1996.09.30
申请人 KYOCERA CORP 发明人 SAKANOUE AKIHIRO;HISATAKA MASAFUMI
分类号 H05K3/28;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/28
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