PHENOL RESIN COMPOSITION, THE PREPARATION THEREOF, AND SEMICONDUCTOR APPARATUS

摘要

The phenol resin molding composition is obtained by subjecting a resol-type phenol resin to purification until, when the resin is extracted by heating with 10 times the amount of hot water at 120 DEG C for 100 hours or more, the extract has an electric conductivity of 100 mu S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less, then preparing a composition comprising said resol-type phenol resin and a cure rate controlling agent incorporated therewith, optionally incorporating a filler into said composition, kneading the resulting mixture, and then grinding the kneaded mixture. The composition has a good moldability and, when used for resin-sealing of electronic devices or semiconductor devices and transfer-molding of electronic devices using resin, exhibits an excellent adhesive property, electric properties, moisture resistance and heat resistance. The cure rate controlling agent used is an epoxy resin.