| 发明名称 |
METHOD AND DEVICE FOR CONTROLLING OPERATION USING TEMPERATURE DEVIATION IN MULTI-CHIP PACKAGE |
| 摘要 |
A multi-chip package includes a first die having temperature sensors and a second die. The first die generates temperature deviation information of m (m<n) bits based on temperature information of n bits produced by the temperature sensors. The first die provides the temperature deviation information of m bits rather than the temperature information of n bits to the second die. An internal operation of the second die is controlled using the temperature deviation information output by the first die. |
| 申请公布号 |
US2016300816(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615007243 |
申请日期 |
2016.01.27 |
| 申请人 |
PARK MIN-SANG |
发明人 |
PARK MIN-SANG |
| 分类号 |
H01L25/065;H01L27/108;H01L23/34 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multi-chip package comprising:
a first die which has first temperature sensors that sense temperatures at areas at which the first temperature sensors are located and output the sensed temperatures as first temperature information of n bits; and at least one second die packaged with the first die, and wherein the first die is configured to output first temperature deviation information of m bits based on the first temperature information, m is less than n, n is a natural number equal to or greater than 2, and each said at least one second die is operatively connected to the first die to receive the first temperature deviation information output by the first die, and is configured to perform an internal operation and to control the internal operation based on the first temperature deviation information. |
| 地址 |
YONGIN-SI KR |
