发明名称 APPARATUS AND METHOD FOR TREATING WAFER AT HIGH PRODUCTIVITY
摘要 PROBLEM TO BE SOLVED: To increase the productivity with low no. of particles comparative to a low particle apparatus by using a buffer robot and a transfer robot and making each robot access to one or more treating chambers via slit valves. SOLUTION: Before a buffer robot 13 transfers a second wafer to an intermediate chamber 19 from a first load lock chamber 37, a transfer robot 17 turns to open a first transfer chamber slit valve 27, extends to a first treating chamber 25 via this valve 27, leaves a first wafer therein and shrinks with the slit valve 27 closed. Before the transfer robot 17 transfers the second wafer from the intermediate chamber 19 to a second treating chamber 31, the buffer robot 13 moves to the lock chamber 37 and picks up a third wafer. Thus the number of particles entering the treating chambers is minimized and hence the robot motion is synchronized with the open-close of the slit valve 27.
申请公布号 JPH10125764(A) 申请公布日期 1998.05.15
申请号 JP19970281755 申请日期 1997.10.15
申请人 APPLIED MATERIALS INC 发明人 ROBERT Z BEICHIREICHI;MARK A POOLE;BENJAMIN L HENNINGS;ROY R STUART
分类号 C23C14/56;H01L21/203;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 C23C14/56
代理机构 代理人
主权项
地址