| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding molded from a low moisture permeability PPE resin compsn. which has significantly improved adhesion to various epoxy adhesive and bonded to the same or a dissimilar material with the epoxy adhesive. SOLUTION: This molding comprises a polyphenylene ether resin compsn. comprising the following components (A) to (D), wherein the content of the component (A) is 1 to 100 pts.wt., the content of the component (B) is 0 to 99 pts.wt., the content of the component (C) is 0.1 to 100 pts.wt. based on 100 pts.wt. in total of the component (A) and (B), and the content of the component (D) is 0 to 70 pts.wt. based on 100 pts.wt. n total of the components (A), (B), and (C), the molding having a portion bonded with an epoxy adhesive: (A): a polyphenylene ether resin; (B): a polystyrene; (C): a copolymer comprising (a) a vinyl arom. compd. and (b) at least one monomer selected from among anα,β-unsatd. cyclic anhydride, anα,β-unstd. dicarboxylic acid, and anα,β-unstd. carboxylic acid; and (D) a filler.
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