| 摘要 |
In the case of the method, a specific amount of solder is initially applied to the connecting pin (4, 5) which is provided with the winding end. The solder can be applied, for example, by immersion of the pin end in a solder bath (11) at a relatively low temperature, or by melting a solder wire. Subsequently, the solder is melted, using a welding burner (13) under a barrier gas (protective gas), at the soft-soldering temperature. In this way, flux-free soldering is possible without the high thermal stress of welding. <IMAGE> |
