发明名称 METHOD FOR DESIGNING LEAD FRAME TIP LAYOUT
摘要 PROBLEM TO BE SOLVED: To enhance flexibility in designing, by setting a lead frame tip disposition area opposite to the die pad sides of the lead frame, setting lead frame tip disposition lines in the lead frame tip disposition area, and disposing the tips of a specified number of lead frames at specified intervals. SOLUTION: The size of a die pad 1, a number of the leads of the lead frame to be disposed, an angle A between segments 8 which define a lead frame tip disposition region 5, and ranges of B-value and C-value which are the distances from a side 2 of the die pad 1 to both the ends Bx, Cx of a segment 9 on which lead frame tips are to be disposed, are entered. Then one value is selected for angle A and one value is selected from the range B-value and C-value can take. If there are candidates of lead frame tip width and spacing, the contour of the lead frame tips is drawn on the segment 9. Thereby an optimal lead frame tip disposition can be automatically designed.
申请公布号 JPH10256456(A) 申请公布日期 1998.09.25
申请号 JP19970057436 申请日期 1997.03.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKI HIROKAZU;GOTO AKIHIRO;TAKAHASHI RYOJI;SUZUKI YASUHITO;TAKAHASHI TAKAO;ARITA TAKASHI;OKU MASARU
分类号 H01L23/50;G06F17/50;H01L23/495;(IPC1-7):H01L23/50 主分类号 H01L23/50
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