| 摘要 |
<p>A thermal infrared detecting device includes a lower layer portion having a readout circuit, and an upper layer portion having a bolometer thin film covered with an insulating protective film to perform heat/resistance conversion. The upper layer portion and the lower layer portion are spaced apart from each other while sandwiching a vacuum or sealed gas to form a thermal isolation structure, and also electrically connected to each other through an electrode film formed on the insulating protective film or in the insulating protective film. The bolometer thin film also serves as an infrared absorption film.</p> |
