| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost, entire thickness, and external size of a semiconductor device and, at the same time, to improve the productivity of the device. SOLUTION: A package main body 1 is formed in a molded article having a recessed section 11 for housing semiconductor element at the central part. A semiconductor element 2 is bonded and fixed to the recessed section 11 of the main body 1. Lead wires 4 having prescribed shapes are respectively connected to the electrode pads 21 of the element 2. In an insulating coating section 5 is provided to cover the surface of the main body 1 in the peripheral area of the recessed section and the sections from the front ends of the connecting sections between the lead wires and pads 21 to the peripheral area of the recessed sections 11. |
