| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a deburring apparatus which can improve a reliability of a semiconductor device by reducing a possibility of a short circuit failure caused by a foreign matter. SOLUTION: The apparatus includes lead wire accommodating parts 7 for accommodating lead wires 3 therein, a vibration applying means 8 for applying vibration to the lead wire accommodating parts 7, and a burr collecting part 13 for collecting burrs 11 released from the cut end faces. The lead accommodating parts 7 are defined by horizontal support plates 5 and partition plates 6 provided thereon and have dumets 3b with cut end faces. Then the lead wires 3 are erected so that the cut end faces of the dumets 3b come into contact with the horizontal support plates 5, vibration is applied from the vibration applying means 8 to the lead wires 3 to vibrate the wires, and the vibration of the wires 3 causes the cut end faces of the dumets 3b to frictionally contact with the horizontal support plates 5. Thereby frictional contact and removal of the burrs 11 formed on the cut end faces can be realized.</p> |
