| 摘要 |
PCT No. PCT/AU92/00439 Sec. 371 Date Feb. 4, 1994 Sec. 102(e) Date Feb. 4, 1994 PCT Filed Aug. 18, 1992 PCT Pub. No. WO93/03913 PCT Pub. Date Mar. 4, 1993.Corrugated paperboards are prepared for corrugation and adhesive bonding of mediums and liners by exposing the mediums liners and adhesives to radiant energy from a thermal source ranging from 1100 DEG C. to 2300 DEG C. and emitting a dominant wavelength in the range of 2.1 to 1.0 microns. The speed of adhesive bond development is increased. Polymeric adhesives may be used as alternatives to conventional starch based adhesives. |
