发明名称 |
Nickel/gold plating of a copper-refractory metal material |
摘要 |
A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.
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申请公布号 |
US5858557(A) |
申请公布日期 |
1999.01.12 |
申请号 |
US19970949981 |
申请日期 |
1997.10.14 |
申请人 |
YOON, SUNGHEE;REED, WILLIAM A. |
发明人 |
YOON, SUNGHEE;REED, WILLIAM A. |
分类号 |
B05D1/36;B32B15/20;C23C28/02;C25D5/12;(IPC1-7):B32B15/20 |
主分类号 |
B05D1/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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