| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting board, which can be easily mounted on a mounting board, suppresses manufacture cost and provides excellent heat dissipation, etc. SOLUTION: A lead frame 22, which extends an outer lead 22a from one side edge of a resin mold 40 and is mounted with a semiconductor chip 30, is resin-sealed. The outer lead 22a is formed in J-shape by separating the bent edge of the lead from the external plane of the resin mold 40, so as to press- contact the outer lead 22a extended from the resin mold part 40 to a connecting pad 52 provided on the surface of a mounting board 50 to be electrically contacted. |
