| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture method of a semiconductor device, where the non-filling of resin and the warp of a semiconductor chip upon completion of resin sealing are prevented and to provide the semiconductor device. SOLUTION: It this manufacture method of a semiconductor device, the semiconductor device having a lead frame is held in a cavity 30, and the semiconductor device is sealed by making resin 32 flow in from a gate 31 provided in the cavity 30. A process for extending an interval between the surface side of the semiconductor device, where the circuit is provided and the surface of the cavity 30, in accordance with a distance from the gate 31 before resin 32 is made to flow-in is provided. |
