| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition capable of forming a pattern superior in heat resistance and electric and mechanical properties on a substrate low in heat resistance by containing a polymide resin soluble in an organic solvent and a specified photopolymerizable unsaturated compound. SOLUTION: This photosensitive resin composition contains the polyimide resin soluble in an organic solvent the photopolymerizable unsaturated compound and a photoppolymerization initiator. The photopolymerizable unsaturated compound is an epoxy acrylate or (meth)acrylic acid having >=3 (meth)acryloyl groups in one molecule. The polyimide resin is, preferably, the ones obtainable from aromatic tetracarboxylic acids and aromatic diamines, for example, the polyimide resin having benzophenonetetracarboxylic acid residues as constituents represented by the formula in which X is an optionally substituted arylene group. |
