| 摘要 |
<p>A fully packaged current monitor system for galvanically isolated current measurement is manufactured in line with commercial IC fabrication and LOC packaging technology. A current path (5) is part of the lead frame on which a die (1) with sensor means (2) is mounted with the aid of an electrically insulating correspondingly pre-patterned glue tape (3), the structured surface of the die (1) facing the lead frame. The system manufactured in this way achieves for currents up to +/- 10 A, a system accuracy of better than 50 mA and is applicable for currents up to the order of 50 A. The system performance can be further improved by ferromagnetic field concentrators and on-chip compensation techniques.</p> |
