发明名称 RESIN MOLDING MATERIAL CONTAINING CONDUCTIVE FILLER
摘要 PROBLEM TO BE SOLVED: To obtain a resin molding material improved in dispersion of a conductive filler, electromagnetic shielding properties and molded appearance by compounding a styrene-acrylonitrile copolymer contg. a conductive filler with another thermoplastic resin. SOLUTION: 1-69 wt.%, pref. 5-40 wt.%, still pref. 10-35 wt.%, conductive filler having a diameter of 1-500μm, pref. 3-100μm, still pref. 5-60μm, and a resistance of 10<10>Ω/square or lower, pref. 10<6>Ω/square or lower, still pref. 10<2>Ω/square or lower, further pref. 10<-1>Ω/square or lower, 1-69 wt.%, pref. 2-40 wt.%, still pref. 3-30 wt.%, styrene-acrylonitrile copolymer and 30-98 wt.% thermoplastic resin other than a styrene-acrylonitrile copolymer are compounded, thus giving a conductive resin compsn. with a high electromagnetic shielding effect and excellent mechanical properties at a low loading of the conductive filler.
申请公布号 JPH1180468(A) 申请公布日期 1999.03.26
申请号 JP19970238152 申请日期 1997.09.03
申请人 ASAHI CHEM IND CO LTD 发明人 NAKAZAWA KEIICHI;ARAKI SHINICHI
分类号 C08K7/06;C08L25/12;C08L101/00;H05K9/00;(IPC1-7):C08L25/12 主分类号 C08K7/06
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