发明名称 |
Ultra-low particle semiconductor cleaner |
摘要 |
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid including water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas including a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.
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申请公布号 |
US5891256(A) |
申请公布日期 |
1999.04.06 |
申请号 |
US19970861456 |
申请日期 |
1997.12.29 |
申请人 |
YIELDUP INTERNATIONAL |
发明人 |
MOHINDRA, RAJ;BHUSHAN, ABHAY;BHUSHAN, RAJIV;PURI, SURAJ;ANDERSON, SR., JOHN H.;NOWELL, JEFFREY |
分类号 |
B08B7/04;B08B3/10;G11B23/50;H01L21/00;H01L21/027;H01L21/304;H01L21/306;(IPC1-7):B08B3/04;B08B5/00 |
主分类号 |
B08B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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