| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component having nondeformed and nondefective electrodes and wiring pattern by providing an electronic component- manufacturing substrate comprising an electrode pattern corresponding to electrodes of the electronic component and mesh-like pattern at other regions. SOLUTION: An electrode pattern 12 corresponding to electrodes of an electronic component, mesh-like pattern (of through-holes) 13 and sprocket holes 14 are formed by the photolithography and wet etching on an SUS substrate 11 to manufacture an electronic component-manufacturing substrate 10. The electronic component having electrodes and wiring pattern on an insulation film base is manufactured by forming a first and second alkali-soluble insulation layers on both surfaces thereof, an insulation film on the second insulation layer, openings at specified points of the second insulation layer, conductor electrodes, a thin film conductor layer of 0.4μm, a wiring conductor layer, and a wiring pattern, and dissolving the second insulation layer by an exclusive stripping liq. to naturally drop the substrate 10.
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