| 摘要 |
PROBLEM TO BE SOLVED: To increase the insulation between conductor circuits and reduce the cost and shorten the time for delivery by allowing metal nuclei to chemically bind with the surface of a resin insulating layer, or physically implanting metal nuclei into the surface and forming conductive circuits constituted of a plated film bound with the metal nuclei on the resin insulating layer. SOLUTION: A copper-clad laminate made by laminating a copper foil 2 on a resin substrate 1 is drilled for holding and inner wall faces of the holes are treated with a modifiyer formed of organometal sodium to improve the wettability of the surface of the substrate. Then, palladium-tin colloid is deposited to the entire surface of the substrate to form an electroless plating film and then an electrolytic copper plating film. Thereafter, the substrate is oxidation-reduction treated to form a roughed layer 4 on the entire surface of a conductor including through holes 3 and then the surface of the substrate is planarized, and a plalladium colloid catalyst is applied to form an electroless copper plating film 6. By this method, the insulation reliability between conductor circuits can be obtained and a printed wiring board can be made at low cost, and the time for delivery can be shortened. |
