| 发明名称 | Sensor chip | ||
| 摘要 | A sensor chip comprises a substrate (1) with a front side (11) and a back side (12), and an opening (13) in the substrate (1) reaching through from its back side (12) to its front side (11). A stack (2) of dielectric and conducting layers is arranged on the front side (11) of the substrate (1), a portion of which stack (2) spans the opening (13) of the substrate (1). Contact pads (32) are arranged at the front side (11) of the substrate (1) for electrically contacting the sensor chip. A sensing element (4) is arranged on the portion of the stack (2) spanning the opening (13) on a side of the portion facing the opening (13). | ||
| 申请公布号 | US9506885(B2) | 申请公布日期 | 2016.11.29 |
| 申请号 | US201514850031 | 申请日期 | 2015.09.10 |
| 申请人 | Sensirion AG | 发明人 | Mayer Felix;Bartsch Ulrich;Winger Martin;Graf Markus;Gerner Pascal |
| 分类号 | H01L27/14;G01N27/04;G01N27/22;G01N27/14;G01N33/00 | 主分类号 | H01L27/14 |
| 代理机构 | Cooper & Dunham LLP | 代理人 | Cooper & Dunham LLP |
| 主权项 | 1. A sensor chip, comprising a substrate with a front side and a back side, an opening in the substrate reaching through from its back side to its front side, a stack of dielectric and conducting layers arranged on the front side of the substrate, a portion of which stack spans the opening in the substrate, contact pads arranged at the front side of the substrate for electrically contacting the sensor chip, and a sensing element arranged on the portion of the stack spanning the opening on a side of the portion facing the opening, wherein electronic circuitry is integrated into the sensor chip at the front side of the substrate. | ||
| 地址 | Stafa CH | ||