发明名称 APPARATUS FOR DISASSEMBLING ELECTRONIC COMPONENT FROM CIRCUIT BOARD
摘要 An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
申请公布号 US2016353622(A1) 申请公布日期 2016.12.01
申请号 US201514848018 申请日期 2015.09.08
申请人 Fu Tai Hua Industry (Shenzhen) Co., Ltd. ;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 ZHENG JIN-SONG;LIANG JING-BIN;HUANG HAI-GUI;LIU JUN-XI;YI MING-JUN;GUO ER-HUI;CHEN ZHOU;HU XI-QIANG
分类号 H05K13/04;B23P19/04 主分类号 H05K13/04
代理机构 代理人
主权项 1. An apparatus for disassembling an electronic component from a circuit board, comprising: a base; a controller fixed to the base; a positioning assembly arranged on the base and coupled to the controller, the positioning assembly being configured to be controlled by the controller to position the circuit board at a first predetermined position; and a heating and suction assembly movably arranged on the base and coupled to the controller, the heating and suction assembly being configured to be controlled by the controller to move to a second predetermined position to heat the electronic component and be controlled by the controller to move to a third predetermined position to attract and hold the electronic component by suction, whereby the electronic component is disassembled from the circuit board.
地址 Shenzhen CN