发明名称
摘要 Copper alloy foils are provided having far greater strength and heat resistance than conventional copper foils, and having better productivity, are characterized by a composition comprising, all by weight, from 0.01 to 0.4% Cr, from 0.01 to 0.25% Zr, from 0.02 to 2.0% Zn; and when necessary from 0.05 to 1.8% Fe and from 0.05 to 0.8% Ti; and when further necessary one or more elements selected from the group consisting of Ni, Sn, In, Mn, P, Mg, Al, B, As, Cd, Co, Te, Ag, and Hf in a total amount of from 0.005 to 1.5%; the balance being copper and unavoidable impurities. Inclusions in the copper foil not larger than 10 mu m in size, and the inclusions between 0.5 and 10 mu m in size number less than 100 pieces/mm2.
申请公布号 JP2898627(B2) 申请公布日期 1999.06.02
申请号 JP19980096960 申请日期 1998.03.26
申请人 NITSUKO KINZOKU KK 发明人 TOMIOKA YASUO
分类号 C22C9/00;C22C9/04;H05K1/09;(IPC1-7):C22C9/04 主分类号 C22C9/00
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