| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wiring board which can enhance reliability of mounting operation in a repair mounting operation. SOLUTION: In a wiring board 10, a plurality of electrodes are formed so as to correspond to respective bump electrodes 3 of a surface mounting-type electronic component, and the respective electrodes are formed to be parallel to each other. Thereby when the surface mounting-type electronic component is repair-mounted, it can be mounted shifted in a direction parallel with respective electrodes of an original surface mounting-type electronic component from a position, in which the original surface mounting-type electronic component is mounted. For example, when the original surface mounting-type electronic component is mounted and even when hollows are formed on the electrodes, the respective bump electrodes of the surface mounting-type electronic component can be bonded to the corresponding electrodes by avoiding a part or all of the hollows. Consequently, it is possible to obtain the wiring board 10 which can improve the reliability of a mounting operation in a repair mounting operation. |
