| 摘要 |
PROBLEM TO BE SOLVED: To prevent an obstacle when an orifice plate is united, invasion of a sealing agent or loss of a discharge pressure, etc., by providing a step intentionally between a substrate and a top plate in connecting, and absorbing the step by a recessed step formed at the orifice plate. SOLUTION: A silicon substrate 1 having a patterned energy generation element 2 is used. 64 ink passage grooves 4 are formed at a top plate 3 with a pitch of 70.5μm by a transfer from a mold to conform to the energy generation element 2 for discharging ink. A 5-10μm step 10 is secured when the substrate 1 is united to the top plate 3. An orifice plate 7 has an orifice 8 and a 20μm recess 9 formed by a KrF excimer laser oscillating a light of a wavelength (λ=248nm) strongly absorptive to polyethersulfone to a 35μm polyethersulfone film.
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