| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device housing package which is capable of effectively preventing noises from penetrating into a semiconductor device and keeping it operating normally for a long term. SOLUTION: A semiconductor device housing package consists of an insulating base 1 which is equipment with a mounting pad 1a mounted with a semiconductor device 3 on its upside, and a wiring layer 5 where a bonding pad 5a connected to the electrode of the semiconductor device 3 is provided at its one edge and a connecting pad 5b connected to an outer electrical circuit is provided at its other edge, and a lid 2. At this point, the insulating base 1 is a sintered body which contains at least one of crystalline phases such as quartz, cristobalite, tridymite, and enstatite and is obtained by burning a molded body which comprises 20 to 80 vol.% lithium silicate glass, that includes 5 to 30 wt.% Li2 O and whose yield point is 400 to 800 deg.C and 20 to 80 vol.% filler of at least one selected from among quartz, cristobalite, tridymite, enstatite, and forsterite, and a magnetic insulating layer 8 is deposited covering around the bonding pad 5a of the wiring layer 5.
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