FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a flexible circuit board having heat resistance and low curl and a manufacturing method. SOLUTION: A flexible circuit board comprises a base layer made of a multi- layer aromatic polyimid film including a thin layer 3 and a metal layer 5 laminated thereon via a heat-resistant adhesive 4. In the case where the multi-layer aromatic polyimide film with the adhesive is employed, since the base layer 2 made of the multi-layer aromatic polyimide film and the thin layer 3 are strongly bonded together by the inter-diffusion and the thin layer 3 and the heat-resistant adhesive 4 are arranged on both sides of the base layer 2, the circuit board does not curl in the following processes where it is subjected to lamination of a metal foil or chemical etching.