| 摘要 |
PROBLEM TO BE SOLVED: To provide a wheel for multiple machining, which applies cutting process or grooving process under a submicron order and does not breakdown an element accompanied by negligence in handling continuity short and static electricity when a workpiece is a semiconductor water or a thin film magnetic head substrate. SOLUTION: This wheel for multiple machining is composed by inserting a plurality of wheel cutters 1 which is formed out of securing an abrasive 3 on a surface of a thin-walled disc 2, and a spacer 4 which has smaller diameter than the wheel cutter 1 and specifies a space between the wheel cutters 1, into a shaft 5 alternately, where the spacer 4 and the shaft 5 are made of ceramic which is 10 GPa or more in diamond pyramid hardness and from 10<2> to 10<9>Ω.cm in electric resistivity. Otherwise, the spacer 4 is made of insulating ceramic more than 10 GPa or more in diamond pyramid hardness which is and has the surface of the shaft 5 made of ceramic from 10<2> to 10<9>Ω.cm in electric resistivity.
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