| 摘要 |
PROBLEM TO BE SOLVED: To provide a waste liquid treatment method and a waste liquid treatment apparatus capable of removing metal contained in a chemical solution and regenerating the chemical solution.SOLUTION: In a substrate treatment unit 10, the surface treatment of the semiconductor substrate W with the chemical solution is performed. The chemical solution in which the metal is dissolved by the substrate treatment is discharged to the storage tank 20 and stored. The polyacid supply unit 30 supplies a polyacid of a defect type complex having a defective site to the storage tank 20. By mixing a polyacid of a defect type complex having a defective site in a used chemical solution containing metal and adjusting the pH value of the mixed solution to 2 to 3, the metal dissolved in the chemical solution at the defective site of the polyacid is incorporated. Furthermore, by charging the counter cation and precipitating the polyacid incorporating the metal and separating it from the chemical solution, it is possible to regenerate the chemical solution by removing the metal contained in the chemical solution during treatment of the semiconductor substrate W.SELECTED DRAWING: Figure 1 |
