Thick film circuit board useful as an IC substrate installed in an automobile engine compartment

摘要

A circuit board has a conduction suppressing agent between silver-containing wiring portions to prevent conduction in the silver deposited on the substrate between the wiring portions. Independent claims are also included for the following: (i) an insulating paste composition containing a potassium compound; (ii) a conductive paste composition comprising a dispersion of silver-containing metal powder and an inorganic binder in an organic vehicle and which also contains a potassium compound; (iii) a conductive paste composition comprising an organic dispersion of silver-containing metal powder and an inorganic binder formed of a substance which prevents evaporation of the silver from the metal powder; (iv) a conductive paste composition comprising a dispersion of silver-containing metal powder in an organic vehicle; (v) an insulating paste composition which is used between the wiring portions of the above circuit board and which comprises the conduction suppressing agent; (vi) a conductive paste composition which is used for the wiring portions of the above circuit board and which comprises the conduction suppressing agent; and (vii) methods of producing the above circuit board.