Installation for washing substrates during manufacture of semiconductor components

摘要

The substrate washing installation is characterized by: (a) cleaning element (53) which lets through liquids, is in contact with an essentially horizontal substrate, and moves relative to the substrate; (b) carrier (30) for the cleaning element; (c) supply unit (92) for delivery of the cleaning liquid to delivery line (12); (d) means for pressing the cleaning element against the substrate; and (e) means (91, 93, 94, 95) for relative horizontal motion between the cleaning element and the substrate. An Independent claim includes method involving holding of the substrate essentially in a horizontal orientation, delivery of a cleaning liquid through the cleaning element onto the substrate surface, pressing of the cleaning element against the substrate surface, and horizontal displacement of the cleaning element relative to the substrate.