| 发明名称 |
Vertical polishing device and method |
| 摘要 |
The present invention relates to a chemical mechanical polishing (CMP) machine and method in which at least one polishing device is provided with a vertically-oriented polishing surface and a slurry delivery mechanism. As a result, the footprint of the machine is greatly reduced and the prevention of contaminants embedding in the polishing device can be promoted.
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| 申请公布号 |
US5928062(A) |
申请公布日期 |
1999.07.27 |
| 申请号 |
US19970846979 |
申请日期 |
1997.04.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MILLER, MATTHEW KILPATRICK;RUTTEN, MATTHEW JEREMY;WRIGHT, TERRANCE MONTE |
| 分类号 |
B24B37/00;B24B37/04;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
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