发明名称 |
Semiconductor module including switching device chips and diode chips |
摘要 |
An inverter device includes plural modules, each module being formed by a series circuit having a parallel circuit of a switching device and a first diode, and a parallel circuit of a second switching device and a second diode, allowing a reduced size, high reliability, high frequency switching and low noise. Each of the semiconductor modules includes a plurality of switching device chips and at least one diode chip formed on a metal substrate. Electrode plates are provided in locations of the module adjacent to the switching device chips and the diode chips to facilitate connection of the electrodes of the respective chips to one another and to the outside of the module.
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申请公布号 |
US5929519(A) |
申请公布日期 |
1999.07.27 |
申请号 |
US19970979778 |
申请日期 |
1997.11.26 |
申请人 |
HITCHI, LTD. |
发明人 |
MORI, MUTSUHIRO;SAITO, RYUICHI;KIMURA, SHIN;SAITOO, SYUUJI;NAKATA, KIYOSHI;HORIE, AKIRA;KOIKE, YOSHIHIKO;SEKINE, SHIGEKI |
分类号 |
H01L23/04;H01L23/24;H01L25/07;H02M7/00;H02M7/48;H02M7/487;H03K17/0814;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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